TUNABLE PERIODIC MICROSTRIP STRUCTURE ON GAAS WAFER

Low Cost Wafer Bumping of GaAs Wafers

The microelectronics industry has implemented a significant number of process technologies to accomplish the various packaging and backend operations. These technologies have been successfully implemented at a number of contract manufacturing companies and also licensed to many of the semiconductor manufacturers and foundries. The largest production volumes for these technologies are for silico...

Microstrip Patch Antennas on Tunable Electromagnetic Band - Gap Substrates

|Full Text: PDF (444 KB) 6. A Communication Perspective on Automatic Text Categorization Capdevila, M.; Florez, O.W.M. Knowledge and Data Engineering, IEEE Transactions on Volume 21, Issue 7, Date: July 2009, Pages: 1027-1041 Digital Object Identifier 10.1109/TKDE.2009.22 Abstract |Full Text: PDF (2515 KB) 7. A Bio-Inspired Active Radio-Frequency Silicon Cochlea Mandal, S.; Zhak, S.M.; Sarpeshk...

Interface structures in GaAs wafer bonding: Application to compliant substrates

A simple de-embeding method for on-wafer RF CMOS FET using two microstrip lines

This letter deals with the de-embedding of on-wafer CMOS FETs embedded in symmetrical and reciprocals pads. A de-embedding method, that uses a calibrated vector network analyzer and two microstrip lines fabricated on a lossy SiO2-Si substrate, is introduced. The proposed method not only allows the characterization on the interconnection lines but also allows the characterization of the CMOS pad...

Effect of Multistep Wafer-Annealing on Main Traps in Czochralski-Grown Semi-Insulating GaAs